Draft docs/funding/board-fab-rfq.md skeleton (EN) #57

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opened 2026-05-25 15:04:11 -03:00 by navigator · 2 comments

navigator commented

2026-05-25 15:04:11 -03:00

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Goal

Create the EN-language board fabrication RFQ skeleton listed as deliverable #10 in PLAN.md Section 10. Structural scaffolding only — actual numbers come from supplier outreach.

Sections to include (EN headings):

Executive summary (placeholder)
Board overview (FluidPopV1 production board: 14-16 layer impedance-controlled, 8 SoCs in 2x4, 8 DDR5 DIMMs, cold plate, OAM 2.0 form factor)
Mechanical and stack-up requirements (layer count, dielectric Megtron 6+, impedance control)
Assembly requirements (FC-BGA >1500 balls, X-ray inspection, ball-shear, CSAM per Section 15.5)
Quantities (first-batch prototype run target, scaling expectations)
Cooling integration interface (cold-plate mounting, G1/4" tubing references per Section 15.11)
Quality and inspection deliverables
Lead time expectations (PCBWay 5-15 days proto; assembly TBD)
Sanction-aware sourcing notes (clean for Brazilian customer; backups: JLCPCB / Würth Elektronik)
Contact and timeline

Acceptance criteria

docs/funding/board-fab-rfq.md exists with the sections above in English
Each section has TODO marker and 2-3 line intent description
Status: Draft skeleton + Owner: TBD header
References PLAN.md Section 11.2 (board cost range US$ 30-50k), Section 15.4 (PCB fab options), Section 15.5 (assembly), Section 15.11 (cooling)
No fabricated prices — only ranges already in PLAN.md
docs/funding/README.md updated to list this deliverable if present

Plan refs

Section 10 (deliverable #10 — EN board RFQ); Section 11.2 (board costs); Sections 15.4, 15.5, 15.11 (suppliers and integration)

Notes

EN per language convention. Skeleton only. The single-chip eval board (Section 11.2.A) is mentioned but not the primary subject — this RFQ is for the production 8-SoC board (Section 11.2.B).

## Goal Create the EN-language board fabrication RFQ skeleton listed as deliverable #10 in PLAN.md Section 10. Structural scaffolding only — actual numbers come from supplier outreach. Sections to include (EN headings): - Executive summary (placeholder) - Board overview (FluidPopV1 production board: 14-16 layer impedance-controlled, 8 SoCs in 2x4, 8 DDR5 DIMMs, cold plate, OAM 2.0 form factor) - Mechanical and stack-up requirements (layer count, dielectric Megtron 6+, impedance control) - Assembly requirements (FC-BGA >1500 balls, X-ray inspection, ball-shear, CSAM per Section 15.5) - Quantities (first-batch prototype run target, scaling expectations) - Cooling integration interface (cold-plate mounting, G1/4" tubing references per Section 15.11) - Quality and inspection deliverables - Lead time expectations (PCBWay 5-15 days proto; assembly TBD) - Sanction-aware sourcing notes (clean for Brazilian customer; backups: JLCPCB / Würth Elektronik) - Contact and timeline ## Acceptance criteria - [ ] `docs/funding/board-fab-rfq.md` exists with the sections above in English - [ ] Each section has `TODO` marker and 2-3 line intent description - [ ] `Status: Draft skeleton` + `Owner: TBD` header - [ ] References PLAN.md Section 11.2 (board cost range US$ 30-50k), Section 15.4 (PCB fab options), Section 15.5 (assembly), Section 15.11 (cooling) - [ ] No fabricated prices — only ranges already in PLAN.md - [ ] `docs/funding/README.md` updated to list this deliverable if present ## Plan refs Section 10 (deliverable #10 — EN board RFQ); Section 11.2 (board costs); Sections 15.4, 15.5, 15.11 (suppliers and integration) ## Notes EN per language convention. Skeleton only. The single-chip eval board (Section 11.2.A) is mentioned but not the primary subject — this RFQ is for the production 8-SoC board (Section 11.2.B).