Draft docs/funding/tapeout-rfq.md skeleton (EN) #56

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opened 2026-05-25 15:04:09 -03:00 by navigator · 2 comments

navigator commented

2026-05-25 15:04:09 -03:00

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Goal

Create the EN-language tapeout RFQ skeleton listed as deliverable #9 in PLAN.md Section 10. This is structural scaffolding so funding/outreach work has a known location to land. No fabricated quotes or commitments — placeholders only.

Sections to include (EN headings):

Executive summary (placeholder)
Project overview (FluidPopV1, RISC-V accelerator, 8-SoC board)
Technical specifications (chip die size estimate range, BGA pin budget ~1100, target nodes IHP130 Edu / SMIC N+2 Pro — all as ranges/TBD)
Quantities and overhead (>= 12 packaged chips per board per Section 11.1)
IP content statement (declaration that design contains no US-origin IP requiring re-export licensing)
Lead time expectations (IHP130 ~6 months MPW; SMIC N+2 16-24 weeks)
Deliverables expected from foundry (GDSII handoff format, PDK version, DRC/LVS sign-off criteria)
Sanction-aware terms (Brazilian customer, EAR/BIS posture)
Contact and timeline

Acceptance criteria

docs/funding/tapeout-rfq.md exists with the sections above in English
Each section has TODO marker and 2-3 line intent description
Status: Draft skeleton + Owner: TBD header
References PLAN.md Section 11.1 (tapeout cost ranges) and Section 15.2 (foundry stack)
No fabricated prices — only ranges already in PLAN.md (US$ 300k-1.5M, NRE US$ 5-15M)
docs/funding/README.md updated to list this deliverable if present

Plan refs

Section 10 (deliverable #9 — EN tapeout RFQ); Section 11.1 (tapeout costs); Section 15.2 (foundry stack); Section 15.14 (engagement timeline)

Notes

EN per language convention (RFQ goes to international foundries). Skeleton only — actual RFQ content lands as Phase 5 approaches and supplier outreach yields concrete contacts.

## Goal Create the EN-language tapeout RFQ skeleton listed as deliverable #9 in PLAN.md Section 10. This is structural scaffolding so funding/outreach work has a known location to land. No fabricated quotes or commitments — placeholders only. Sections to include (EN headings): - Executive summary (placeholder) - Project overview (FluidPopV1, RISC-V accelerator, 8-SoC board) - Technical specifications (chip die size estimate range, BGA pin budget ~1100, target nodes IHP130 Edu / SMIC N+2 Pro — all as ranges/TBD) - Quantities and overhead (>= 12 packaged chips per board per Section 11.1) - IP content statement (declaration that design contains no US-origin IP requiring re-export licensing) - Lead time expectations (IHP130 ~6 months MPW; SMIC N+2 16-24 weeks) - Deliverables expected from foundry (GDSII handoff format, PDK version, DRC/LVS sign-off criteria) - Sanction-aware terms (Brazilian customer, EAR/BIS posture) - Contact and timeline ## Acceptance criteria - [ ] `docs/funding/tapeout-rfq.md` exists with the sections above in English - [ ] Each section has `TODO` marker and 2-3 line intent description - [ ] `Status: Draft skeleton` + `Owner: TBD` header - [ ] References PLAN.md Section 11.1 (tapeout cost ranges) and Section 15.2 (foundry stack) - [ ] No fabricated prices — only ranges already in PLAN.md (US$ 300k-1.5M, NRE US$ 5-15M) - [ ] `docs/funding/README.md` updated to list this deliverable if present ## Plan refs Section 10 (deliverable #9 — EN tapeout RFQ); Section 11.1 (tapeout costs); Section 15.2 (foundry stack); Section 15.14 (engagement timeline) ## Notes EN per language convention (RFQ goes to international foundries). Skeleton only — actual RFQ content lands as Phase 5 approaches and supplier outreach yields concrete contacts.