docs(funding): EN tapeout RFQ skeleton (Phase 5 deliverable #9) #60

Merged

navigator merged 1 commit from auto/issue-56-20260525T191448Z_issue56 into main

2026-05-25 16:23:18 -03:00

navigator commented

2026-05-25 16:17:43 -03:00

Owner

Promotes docs/funding/tapeout-rfq.md from Stub to Draft skeleton, satisfying PLAN.md Section 10 deliverable #9.

What changed

docs/funding/tapeout-rfq.md — nine sections required by the issue (executive summary, project overview, technical specifications, quantities and overhead, IP content statement, lead time expectations, foundry deliverables, sanction-aware terms, contact and timeline), each with a TODO marker and 2–3 line intent description; Status: Draft skeleton / Owner: TBD header preserved; footer enumerates referenced PLAN.md sections (10, 11.1, 15.2, 15.7, 15.14) and ADRs (014 BGA pin budget, 015 foundry path).
docs/funding/README.md — RFQ status updated Stub → Draft skeleton.

No fabricated numbers

All monetary and schedule figures trace back to PLAN.md:

Tapeout cost envelope US$ 300k–1.5M per design, NRE US$ 5–15M, ≥12 packaged chips per board (PLAN.md Section 11.1).
IHP130 ~6 months MPW, SMIC N+2 16–24 weeks (PLAN.md Section 15.2).
BGA pin budget ~1100 (Edu) / ~1500 (Pro) per ADR-014.

Out of scope

No prices invented. No supplier identities committed. No re-export licensing claims beyond declaring the design free of US-origin IP requiring such licensing (placeholder for counsel review before issue). Concrete RFQ content lands as Phase 5 approaches and supplier outreach (PLAN.md Section 15.14) yields contacts.

Closes #56

Promotes `docs/funding/tapeout-rfq.md` from Stub to Draft skeleton, satisfying PLAN.md Section 10 deliverable #9. ## What changed - `docs/funding/tapeout-rfq.md` — nine sections required by the issue (executive summary, project overview, technical specifications, quantities and overhead, IP content statement, lead time expectations, foundry deliverables, sanction-aware terms, contact and timeline), each with a `TODO` marker and 2–3 line intent description; `Status: Draft skeleton` / `Owner: TBD` header preserved; footer enumerates referenced PLAN.md sections (10, 11.1, 15.2, 15.7, 15.14) and ADRs (014 BGA pin budget, 015 foundry path). - `docs/funding/README.md` — RFQ status updated `Stub` → `Draft skeleton`. ## No fabricated numbers All monetary and schedule figures trace back to PLAN.md: - Tapeout cost envelope US$ 300k–1.5M per design, NRE US$ 5–15M, ≥12 packaged chips per board (PLAN.md Section 11.1). - IHP130 ~6 months MPW, SMIC N+2 16–24 weeks (PLAN.md Section 15.2). - BGA pin budget ~1100 (Edu) / ~1500 (Pro) per ADR-014. ## Out of scope No prices invented. No supplier identities committed. No re-export licensing claims beyond declaring the design free of US-origin IP requiring such licensing (placeholder for counsel review before issue). Concrete RFQ content lands as Phase 5 approaches and supplier outreach (PLAN.md Section 15.14) yields contacts. Closes #56

navigator added 1 commit

2026-05-25 16:17:43 -03:00

docs(funding): EN tapeout RFQ skeleton (Phase 5 deliverable #9 )

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43cbc59ab9

Promote docs/funding/tapeout-rfq.md from Stub to Draft skeleton with
the nine sections required by PLAN.md Section 10 deliverable #9:
executive summary, project overview, technical specifications,
quantities and overhead, IP content statement, lead time expectations,
foundry deliverables, sanction-aware terms, contact and timeline.

Each section carries a TODO marker and a 2-3 line intent description.
No fabricated prices: every monetary or schedule figure traces back to
PLAN.md Section 11.1 (US$ 300k-1.5M per design, NRE US$ 5-15M, >=12
packaged chips per board) and Section 15.2 (IHP130 ~6 months MPW, SMIC
N+2 16-24 weeks). Footer enumerates the referenced PLAN.md sections
and ADRs (014, 015) so finalization in Phase 5 has a known anchor set.

Funding README updated to reflect the new status.